Monday, Nov. 16, a.m. / KFC Hall
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Tutorial I
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Chairman: Yasunori Goto |
(T1) |
Future prospects for semiconductor material and device evaluation by SNDM
Y. Cho
Research Institute of Electrical Communication, Tohoku Univ.
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9:30-10:30 |
《 10:30-10:45 Authors corner & break》 |
Physical Analysis I
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Chairman: Toru Koyama |
(1) |
Carrier measurement methodology for 3D flash memory cell using scanning nonlinear dielectric microscopy
J. Hirota(a, K. Yamasue(b, K. Hoshino(a, and Y. Cho(b
a)Institute of Memory Technology Research & Development, KIOXIA Corp., b)Research Institute of Electrical Communication, Tohoku Univ.
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10:45-11:10 |
(2) |
Investigation of contrast change in SNDM images for carrier distribution on semiconductors from the aspect of surface potential analysis using KFM
Y. Miyato, H. Nozaki, and Y. Terui
Evaluation and Analysis Technology Center, Toshiba Nanoanalysis Corp.
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11:10-11:35 |
《 11:35-12:05 Authors corner & break》 |
《 12:05-13:00 Lunch Break》 |
Monday, Nov. 16, p.m. / KFC Hall
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Physical Analysis II
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Chairman: Yasuo Cho |
(3) |
STEM-EDS effective sensitivity improvement by combination of principal component analysis method and energy-corrected peak fitting
A. Sugiyama, Y. Shimada, T. Ide, and Y. Kunimune
Analysis and Evaluation Technology Dept., Device Technology Div., Production and Technology Unit, Renesas Electronics
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13:00-13:25 |
(4) |
Quantitative evaluation of N concentration of WN films using atom probe tomography
A. Sakamoto, A. Kuramoto, and T. Kinno
Institute of Memory Technology Research & Development, Kioxia Corp.
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13:25-13:50 |
《 13:50-14:20 Authors corner & break》 |
Invited Talk I
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Chairman: Yasunori Gto |
(I1) |
Characterization of semiconductor crystals based on omnidirectional photoluminescence (ODPL) spectroscopy
K. Kojima and S. Chichibu
Institute of Multidisciplinary Research for Advanced Materials, Tohoku Univ.
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14:20-14:50 |
《 14:50-15:05 Authors corner & break》 |
Power Device Analysis
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Chairman: Yasuhisa Higuchi |
(5) |
High-speed high-voltage lock-in thermography observation method using high-order harmonic analysis
K. Koshikawa(a, K. Endo(b, N. Chinone(a, T. Kaneoka(a, and T. Matsumoto(a
a)Systems Div., Hamamatsu Photonics K. K., b)Discrete Semiconductor Quality & Reliability Engineering Dept., Toshiba Electronic Devices & Storage Corp.
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15:05-15:30 |
《 15:30-15:45 Authors corner & break》 |
Commercial Session
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Chairman: Yasuhisa Higuchi |
(C1) |
New concept of nano-probing system
Y. Nakashima(a, J. Sukegawa(a, Y. Shibata(b, and C. Rob(c
a)Sales I Div., TOKI COMMERCIAL Co., LTD, b)Engineering Dept., TNS Systems LLC, c)Sales Div., Imina Technologies SA
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15:45-15:53 |
(C2) |
Complementary analysis for dislocations of GaN compound semiconductors using STEM and APT
N. Mayama(a, K. Watanabe(a, J. Koyama(a, S. Ishimura(a, M. Suganuma(a, and M. Sugiyama(b
a)Physical Analysis Technology Center, Toshiba Nanoanalysis, b)Research Center for Advanced Science and Technology, Univ. Tokyo
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15:53-16:01 |
(C3) |
Introduction of FIB circuit edit service for 16nm generation
K. Inomata, H. Kawahara, and H. Tsukui
Evaluation Analysis Dept., Renesas Engineering Services Co., Ltd.
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16:01-16:09 |
(C4) |
Failure analysis for avoiding repeated product accidents?failure analysis based on nondestructive analysis?
K. Takamori, K. Takamori, Y. Sakaki, and K. Hyoudou
Oki Engineering Co., Ltd.
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16:09-16:17 |
(C5) |
High-performance FIB-SEM ethos NX5000 series - introduction of ethos NX5100/ethos NX5200 -
M. Suzuki(a, Y. Yamamoto(a, N. Hirose(a, M. Kiyohara(a, H. Suzuki(a, Y. Sugiyama(a, T. Asahata(a, and C. Kamiya(b
a)Beam Technology Systems Design Dept., Hitachi High-Tech Science Corp., b)Electron Microscope Systems Design Dept., Hitachi High-Tech Corp.
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16:17-16:25 |
(C6) |
Carrier distribution analysis in semiconductor by sMIM (scanning microwave impedance microscope)
K. Takagi, M. Gotoh, Y. Nishioka, Y. Maegawa, and K. Atarashi
Quality Engineering Dept., ITES Co., Ltd.
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16:25-16:33 |
(C7) |
Applications of laser-raman spectroscopy for semiconductors
K. Isoo
Chemical Analysis Center, TAKASAGO Lab., Analysis, Testing & Research Business, Technology Unit, Kobelco Research Institute, Inc.
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16:33-16:41 |
(C8) |
Submicron 3D X-ray microscope "PrismaXRM" with talbot-lau interferometer
T. Ogaki
Measurement and analysis instruments Div., Sales Group2, Industrial Equipment Headquarters, Canon Marketing Japan Inc.
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16:41-16:49 |
Tuesday, Nov. 17, a.m. / KFC Hall
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Electron Optics & Application I
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Chairman: Hitoshi Maeda |
(6) |
Irradiation performance of pulsed electron gun using negative electron affinity (NEA) photocathode
H. Morishita(a, T. Ohshima(a, K. Otsuga(a, M. Kuwahara(b, T. Agemura(c, and Y. Ose(c
a)Research and Development Group, Hitachi, Ltd., b)Institute of Materials and Systems for Sustainability, Nagoya Univ., c)Hitachi High-Tech Corp.
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9:30-9:55 |
(7) |
Improvement of phase accuracy in electron holography by noise suppression in the Fourier domain
T. Okada, Y. Midoh, K. Nakamae, and N. Miura
Grad. Sch. Information Science and Technology, Osaka Univ.
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9:55-10:20 |
《 10:20-10:50 Authors corner & break》 |
Electron Optics & Application II
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Chairman: Yoichi Ose |
(8) |
Studies of automating FIB-SEM processes
Y. Aizawa(a, T. Sato(a, A. Morikawa(a, M. Suzuki(b, and S. Tomimatsu(b
a)Electron Microscope Solution Group, Hitachi High-Tech Corp., b)Beam Technology System Design Group 1, Hitachi High-Tech Science Corp.
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10:50-11:15 |
(9) |
Sample preparation for TEM analysis by FIB processing under peltier
S. Torikawa, T. Iwahori, and T. Asahata
Beam Technology Design Dept., Hitachi High-Tech Science Corp.
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11:15-11:40 |
《 11:40-12:10 Authors corner & break》 |
《 12:10-13:10 Lunch Break》 |
Tuesday, Nov. 17, p.m. / KFC Hall
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Tutorial II
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Chairman: Hirotoshi Terada |
(T2) |
Procedure of failure analysis on semiconductor devices
A. Shimase
Semiconductor Inspection Systems Dept., Hamamatsu Photonics K. K.
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13:10-14:10 |
《 14:10-14:25 Authors corner & break》 |
Fault Localization I
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Chairman: Kiyoshi Nikawa |
(10) |
A technique of IDDQ based cell-internal fault diagnosis
S. Nomura, N. Matsui, T. Ohkubo, Y. Hanazaki, S. Wada, and H. Tsukui
Evaluation Analysis Dept., Renesas Engineering Services Co., Ltd.
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14:25-14:50 |
(11) |
Effectiveness studies of EOFM (electro optical frequency mapping) for short circuit defects
M. Saeki, Y. Matsumoto, and H. Tsukui
Evaluation Analysis Dept., Renesas Engineering Services Co., Ltd.
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14:50-15:15 |
《 15:15-15:30 Authors corner & break》 |
Fault Localization II
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Chairman: Hitoshi Maeda |
(12) |
SEM based electrical probing solutions and applications for micro and nanoscale device characterization
R. Claassen and G. Boetsch
Sales Div., Imina Technologies SA
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15:30-15:55 |
(13) |
Analytical method for the CMOS image sensor by the voltage applied EBAC
Y. Katakura, M. Tsujita, N. Yamauchi, and T. Kawamura
Device Engineering Div. Device Analysis Engineering Dept., Sony Semiconductor Manufacturing Corp.
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15:55-16:20 |
《 16:20-16:50 Authors corner & break》 |
Special Invited Talk
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Chairman: Hirotoshi Terada |
(S1) |
Testing of automotive-grade silicon carbide power MOSFETs for normal and abnormal operations
F. Iannuzzo
Faculty of Engineering and Science, Aalborg Univ.
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16:50-17:50 |
《 17:50-18:05 Authors corner & break》 |
Evening Session I
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Location: KFC Hall |
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Evening Session I
Evening session of NANOTS is a special session for discussing on research trend around the world and the future perspective.
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18:05-19:00 |
Evening Session II Invited Talk II
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Chairman: Koji Nakamae |
(I2) |
The potential of diamond solid-state quantum sensors
M. Hatano
School of Engineering, Tokyo Institute of Technology
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19:00-20:00 |
《 20:00 Close》 |
Wednesday, Nov. 18, a.m. / KFC Hall
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Tutorial III
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Chairman: Koji Nakamae |
(T3) |
Application developments of machine learning and deep learning in metrology
Y. Midoh
Grad. Sch. Information Science and Technology, Osaka Univ.
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9:30-10:30 |
《 10:30-10:45 break》 |
Machine Learning for Process Control I
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Chairman: Suigen Kyoh |
(14) |
AI-FDC: A modern approach to process control
R. Burch(a, K. Kunitoshi(b, and M. Keleher(b
a)AI Solutions, PDF Solutions, Inc., b)Japan Apps and Data Integration, PDF Solutions, Inc., c)Japan Account Management, PDF Solutions, Inc.
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10:45-11:10 |
(15) |
Study on explainability of experimental data using a neural network with physical models
T. Takemoto, Y. Midoh, K. Nakamae, and N. Miura
Grad. Sch. Information Science and Technology, Osaka Univ.
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11:10-11:35 |
《 11:35-12:05 Authors corner & break》 |
《 12:05-13:00 Lunch Break》 |
Wednesday, Nov. 18, p.m. / KFC Hall
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Machine Learning for Process Control II
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Chairman: Yoichi Ose |
(16) |
Change-point prediction in time-series using dimensionality reduction and deep learning
K. Otsuka, Y. Midoh, K. Nakamae, and N. Miura
Grad. Sch. Information Science and Technology, Osaka Univ.
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13:00-13:25 |
(17) |
Deep reinforcement learning in continuous state and action spaces under partial observation
T. Nishimura, Y. Midoh, K. Nakamae, and N. Miura
Grad. Sch. Information Science and Technology, Osaka Univ.
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13:25-13:50 |
《 13:50-14:20 Authors corner & break》 |
Metrology and Inspection
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Chairman: Yuichiro Yamazaki |
(18) |
SEM image generator with charging effect by monte carlo simulation and deep learning
K. Iwamoto, Y. Midoh, K. Nakamae, and N. Miura
Grad. Sch. Information Science and Technology, Osaka Univ.
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14:20-14:45 |
(19) |
Cross-sectional profile measurement of deep holes in three-dimensional devices by small angle x-ray scattering
Y. Ito, T. Goto, and K. Omote
X-ray Research Lab., Rigaku Corp.
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14:45-15:10 |
《 15:10-15:40 Authors corner & break》 |
Panel Discussion
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Moderator: Suigen Kyoh (Kioxia Corp.) |
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Profile measurements of high aspect ratio patterns in memory devices
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15:40-16:40 |
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M. Asano (Tokyo Electron Ltd.)
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S. Wei (Hitachi Ltd.)
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Y. Ito (Rigaku Corp.)
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N. Nakanishi (Thermo Fisher Scientific)
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"H.~Tanizaki (Kioxia Corp.)")// ProgramNo(P1
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(P1) |
Requirement for metrology of HAR pattern from the view point of tool vender
M. Asano
Tokyo Electron Ltd.
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(P2) |
High-voltage CD-SEM-based application to monitor 3D profile of high-aspect-ratio features
S. Wei
Hitachi Ltd.
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(P3) |
Cross-sectional profile measurement of deep holes in three-dimensional devices by small angle X-ray scattering
Y. Ito
X-ray Research Lab., Rigaku Corp.
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(P4) |
Metrology of high aspect ratio devices using FIB and S/TEM
N. Nakanishi
Materials & Structural Analysis, Thermo Fisher Scientific Inc.
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(P5) |
Metrology requirements for 3D flash-memory
H. Tanizaki
Institute of Memory Technology Research & Development, KIOXIA Corp.
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《 16:40-17:00 Networking with panelists》 |