NANOTS2017

Scope

The nano testing Symposium (NANOTS) provides a forum for engineers and researchers especially from Japan, to present and discuss various aspects of nano testing. The official languages of the symposium are Japanese and English. Translation service is not provided.

Topics of interest include:

ADVANCED DESIGN METHODOLOGIES FOR NANO TESTING Design error diagnosis Design for debug and diagnosis (DFD) Design for manufacturing (DFM) Design for reliability (DFR) Design for testability (DFT) Design for yield (DFY) ADVANCED PROCESS TECHNIQUES FOR NANO TESTING Interconnect: copper/low-k reliability Wafer preparation Physical characterization of wafers Electrical characterization of wafers Surface preparation: control and monitoring of surface treatment Cleaning Process control Dopant diffusion Oxidation and gate dielectrics: metrology of dielectric films Optical lithography Photomask fabrication: photomask qualification Equipment reliability In-line metrology Metrology for lithography processes Metrology for front end processes Interconnect process control In-FAB FIB In-situ metrology Yield modeling Yield management Electrical, Physical, and Chemical Characterization ADVANCED NANO TESTING System-on-chip testing Memory testing Delay testing Low-power testing Built-in self-testing Software-based selftesting Analog and mixed-signal testing IDDQ testing Burn-in testing FPGA testing High-speed I/O testing RF testing RELIABILITY PHYSICS AND ENGINEERING Accelerated testing Time-to-failure modeling Time-to-failure statistics Failure rate Acceleration factor Time-dependent dielectric breakdown EFFECTS OF RADIATION ON INTEGRATED CIRCUITS Radiation effects on semiconductor devices Mitigation techniques ADVANCED IC-LEVEL DEBUG AND DIAGNOSIS Silicon debug Defect diagnosis Cause-effect analysis Effectcause analysis Scan chain diagnosis Logic BIST diagnosis Memory diagnosis and built-in self-repair

ADVANCED PROBING TECHNOLOGIES FOR DEBUG AND DIAGNOSIS Die exposure technique Mechanical probing Injection-based probing E-beam probing Larser beam probing (laser voltage probing, resistance change (OBIRCH, SDL)) Emission microscopy Emission-based probing Infrared emission microscopy (IREM) Picosecond imaging circuit analysis (PICA) Time-resolved emissions (TRE) Others ADVANCED CIRCUIT EDITING FOR DEBUG AND DIAGNOSIS Focused Ion Beam Layout-database-driven navigation system PHYSICAL ANALYSIS TOOL FOR FAILURE ANALYSIS Package analysis Deprocessing Parallel polishing Cross-section analysis Microscopy Transmission electron microscopy (TEM) Others CHEMICAL CHARACERIZATION FOR FAILURE ANALYSIS X-ray analysis (energy dispersive) Auger Secondary ion mass spectroscopy (SIMS) Microspot Fourier transform infrared spectroscopy Others FAILURE MECHANISMS IN NEW MATERIALS AND TRANSISTORS Process-related issues Hot carriers NBTI PBTI Passivation stability Dielectric integrity High-k gate oxides Latchup ESD Metal migration: mechanical and thermal aspects Low-k dielectrics and Cu interconnects Reliability related to nanotechnology ECONOMICS OF NANO TESTING Economic effects Economic models The learning curve Technological driving forces Factory and equipment economics TESTING FOR NEW DEVICES (including Devices for Biological Sci- ence, Medical Applications and Health Monitoring) Micro Electro Mechanical Systems (MEMS, BioMEMS) Sensors Liquid Crystal Display (LCD) Nano-tube PRAM RRAM FRAM Others ADVANCED TESTING EQUIPMENT AND SYSTEMS Transmission electron microscope (TEM) Scanning electron microscope (SEM) Focused ion beam (FIB) Scanning Probe Microscope Others CASE STUDIES OF NANO TESTING Electrical characterization Die exposure Package analysis Global failure site isolation Probe failure site isolation Defect exposure Physical inspection Chemical analysis

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